News

20.09.2026

Hipercone to present KiSSAM at ICAM 2026 International Conference on Advanced Manufacturing in Orlando, Florida

Hipercone will present the latest developments and capabilities of KiSSAM Simulation Software for Additive Manufacturing at ICAM 2026, the International Conference on Advanced Manufacturing, taking place in Orlando, Florida.

23.10.2025

MULTICOMP 1.2 – A New Release of the Multilevel Simulation Package for Polymer Nanocomposites

We are pleased to announce the release of MULTICOMP 1.2, a software package developed for multiscale modeling and simulation of polymer-based nanomaterials. This release introduces several new modules, extended functionality, and enhanced computational capabilities designed to support advanced research in polymer physics and materials science.

30.08.2025

Hipercone to Present Groundbreaking Multilayer Mesoscopic Simulations at SIM-AM 2025

From melt pool to microstructure: multilayer simulations redefine our understanding of additive manufacturing

26.02.2025

Hipercone presenting KiSSAM at EBAM 2025

We’re excited to announce that Hipercone will be taking part in EBAM 2025 at FAU Erlangen! Join us at our company booth in terms of the Conference Exhibition among with the academia & industry leaders and promising startups. Attend our talk about KiSSAM, our cutting-edge simulation software for powder bed fusion (PBF) additive manufacturing.